Abstract

This article presents the flip-chip bonding of vertical-cavity surface-emitting lasers (VCSELs) to silicon grating couplers (GCs) via SU8 prisms. The SU8 prisms are defined on top of the GCs using non-uniform laser ablation process. The prisms enable perfectly vertical coupling from the bonded VCSELs to the GCs. The VCSELs are flip-chip bonded on top of the silicon GCs employing the laser-induced forward transfer (LIFT)-assisted thermocompression technique. An excess loss of < 1 dB at 1.55 µm measured from the bonded assemblies is reported in this paper. The results of high speed transmission experiments performed on the bonded assemblies with clear eye openings up to 20 Gb/s are also presented.

© 2015 Optical Society of America

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  1. S. Selvaraja, P. De Heyn, G. Winroth, P. Ong, G. Lepage, C. Cailler, A. Rigny, K. Bourdelle, W. Bogaerts, D. Van Thourhout, J. Van Campenhout, and P. Absil, “Highly uniform and low-loss passive silicon photonics devices using a 300 mm CMOS platform,” in Optical Fiber Communication Conference, OSA Technical Digest online (Optical Society of America, 2014), pp. Th2A.33.
  2. D. Vermeulen, S. Selvaraja, P. Verheyen, G. Lepage, W. Bogaerts, P. Absil, D. Van Thourhout, and G. Roelkens, “High-efficiency fiber-to-chip grating couplers realized using an advanced CMOS-compatible silicon-on-insulator platform,” Opt. Express 18(17), 18278–18283 (2010).
    [Crossref] [PubMed]
  3. M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).
  4. L. Pavesi, L. Dal Negro, C. Mazzoleni, G. Franzò, and F. Priolo, “Optical gain in silicon nanocrystals,” Nature 408(6811), 440–444 (2000).
    [Crossref] [PubMed]
  5. A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
    [Crossref]
  6. M. Tang, S. Chen, J. Wu, Q. Jiang, V. G. Dorogan, M. Benamara, Y. I. Mazur, G. J. Salamo, A. Seeds, and H. Liu, “1.3-μm InAs/GaAs quantum-dot lasers monolithically grown on Si substrates using InAlAs/GaAs dislocation filter layers,” Opt. Express 22(10), 11528–11535 (2014).
    [Crossref] [PubMed]
  7. S. Keyvaninia, S. Verstuyft, L. Van Landschoot, F. Lelarge, G. H. Duan, S. Messaoudene, J. M. Fedeli, T. De Vries, B. Smalbrugge, E. J. Geluk, J. Bolk, M. Smit, G. Morthier, D. Van Thourhout, and G. Roelkens, “Heterogeneously integrated III-V/silicon distributed feedback lasers,” Opt. Lett. 38(24), 5434–5437 (2013).
    [Crossref] [PubMed]
  8. Y. Cheng, X. Luo, J. Song, T. Y. Liow, G. Q. Lo, Y. Cao, X. Hu, X. Li, P. H. Lim, and Q. J. Wang, “Passively mode-locked III-V/silicon laser with continuous-wave optical injection,” Opt. Express 23(5), 6392–6399 (2015).
    [Crossref] [PubMed]
  9. G. Roelkens, D. Van Thourhout, and R. Baets, “High efficiency grating coupler between silicon-on-insulator waveguides and perfectly vertical optical fibers,” Opt. Lett. 32(11), 1495–1497 (2007).
    [Crossref] [PubMed]
  10. Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
    [Crossref]
  11. J. Schrauwen, S. Scheerlinck, D. Van Thourhout, and R. Baets, “Polymer wedge for perfectly vertical light coupling to silicon,” Proc. SPIE 7218, 72180B (2009).
    [Crossref]
  12. K. S. Kaur, J. Missinne, and G. Van Steenberge, “Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer,” Appl. Phys. Lett. 104(6), 061102 (2014).
    [Crossref]
  13. http://www.epixfab.eu
  14. J. E. A. Pedder, A. S. Holmes, R. Allott, and K. Boehlen, “Pulsed laser ablation for volume micro-optical arrays on large area substrates,” Proc. SPIE 6462, 64620W (2007).
    [Crossref]
  15. M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
    [Crossref]

2015 (1)

2014 (2)

2013 (3)

S. Keyvaninia, S. Verstuyft, L. Van Landschoot, F. Lelarge, G. H. Duan, S. Messaoudene, J. M. Fedeli, T. De Vries, B. Smalbrugge, E. J. Geluk, J. Bolk, M. Smit, G. Morthier, D. Van Thourhout, and G. Roelkens, “Heterogeneously integrated III-V/silicon distributed feedback lasers,” Opt. Lett. 38(24), 5434–5437 (2013).
[Crossref] [PubMed]

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

2011 (1)

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

2010 (1)

2009 (1)

J. Schrauwen, S. Scheerlinck, D. Van Thourhout, and R. Baets, “Polymer wedge for perfectly vertical light coupling to silicon,” Proc. SPIE 7218, 72180B (2009).
[Crossref]

2007 (2)

J. E. A. Pedder, A. S. Holmes, R. Allott, and K. Boehlen, “Pulsed laser ablation for volume micro-optical arrays on large area substrates,” Proc. SPIE 6462, 64620W (2007).
[Crossref]

G. Roelkens, D. Van Thourhout, and R. Baets, “High efficiency grating coupler between silicon-on-insulator waveguides and perfectly vertical optical fibers,” Opt. Lett. 32(11), 1495–1497 (2007).
[Crossref] [PubMed]

2000 (1)

L. Pavesi, L. Dal Negro, C. Mazzoleni, G. Franzò, and F. Priolo, “Optical gain in silicon nanocrystals,” Nature 408(6811), 440–444 (2000).
[Crossref] [PubMed]

Absil, P.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

D. Vermeulen, S. Selvaraja, P. Verheyen, G. Lepage, W. Bogaerts, P. Absil, D. Van Thourhout, and G. Roelkens, “High-efficiency fiber-to-chip grating couplers realized using an advanced CMOS-compatible silicon-on-insulator platform,” Opt. Express 18(17), 18278–18283 (2010).
[Crossref] [PubMed]

Allott, R.

J. E. A. Pedder, A. S. Holmes, R. Allott, and K. Boehlen, “Pulsed laser ablation for volume micro-optical arrays on large area substrates,” Proc. SPIE 6462, 64620W (2007).
[Crossref]

Amann, M. C.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Baets, R.

J. Schrauwen, S. Scheerlinck, D. Van Thourhout, and R. Baets, “Polymer wedge for perfectly vertical light coupling to silicon,” Proc. SPIE 7218, 72180B (2009).
[Crossref]

G. Roelkens, D. Van Thourhout, and R. Baets, “High efficiency grating coupler between silicon-on-insulator waveguides and perfectly vertical optical fibers,” Opt. Lett. 32(11), 1495–1497 (2007).
[Crossref] [PubMed]

Benamara, M.

Bimberg, D.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Boehlen, K.

J. E. A. Pedder, A. S. Holmes, R. Allott, and K. Boehlen, “Pulsed laser ablation for volume micro-optical arrays on large area substrates,” Proc. SPIE 6462, 64620W (2007).
[Crossref]

Bogaerts, W.

Bohm, G.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Bojko, R.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Bolk, J.

Boninelli, S.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Cao, Y.

Cardile, P.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Chen, S.

Cheng, Y.

Christie, P.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

Chrostowski, L.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Cunningham, J.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Dal Negro, L.

L. Pavesi, L. Dal Negro, C. Mazzoleni, G. Franzò, and F. Priolo, “Optical gain in silicon nanocrystals,” Nature 408(6811), 440–444 (2000).
[Crossref] [PubMed]

De Vries, T.

Djordjecvic, S.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Dorogan, V. G.

Duan, G. H.

Fedeli, J. M.

Franzò, G.

L. Pavesi, L. Dal Negro, C. Mazzoleni, G. Franzò, and F. Priolo, “Optical gain in silicon nanocrystals,” Nature 408(6811), 440–444 (2000).
[Crossref] [PubMed]

Franzo’, G.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Galli, M.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Geluk, E. J.

Gerace, D.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Grundl, T.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Hofmann, W.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Holmes, A. S.

J. E. A. Pedder, A. S. Holmes, R. Allott, and K. Boehlen, “Pulsed laser ablation for volume micro-optical arrays on large area substrates,” Proc. SPIE 6462, 64620W (2007).
[Crossref]

Horn, M.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Hu, X.

Jaeger, N. A. F.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Jiang, Q.

Kaur, K. S.

K. S. Kaur, J. Missinne, and G. Van Steenberge, “Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer,” Appl. Phys. Lett. 104(6), 061102 (2014).
[Crossref]

Keyvaninia, S.

Krauss, T. F.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Krishnamoorthy, A. V.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Lelarge, F.

Lepage, G.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

D. Vermeulen, S. Selvaraja, P. Verheyen, G. Lepage, W. Bogaerts, P. Absil, D. Van Thourhout, and G. Roelkens, “High-efficiency fiber-to-chip grating couplers realized using an advanced CMOS-compatible silicon-on-insulator platform,” Opt. Express 18(17), 18278–18283 (2010).
[Crossref] [PubMed]

Li, X.

Lim, P. H.

Liow, T. Y.

Liu, H.

Lo, G. Q.

Lo Savio, R.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Luo, X.

Mazur, Y. I.

Mazzoleni, C.

L. Pavesi, L. Dal Negro, C. Mazzoleni, G. Franzò, and F. Priolo, “Optical gain in silicon nanocrystals,” Nature 408(6811), 440–444 (2000).
[Crossref] [PubMed]

Messaoudene, S.

Missinne, J.

K. S. Kaur, J. Missinne, and G. Van Steenberge, “Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer,” Appl. Phys. Lett. 104(6), 061102 (2014).
[Crossref]

Morthier, G.

Muller, M.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Müller, M.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Nagel, R. D.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

O’Faolain, L.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Pantouvaki, M.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

Pavesi, L.

L. Pavesi, L. Dal Negro, C. Mazzoleni, G. Franzò, and F. Priolo, “Optical gain in silicon nanocrystals,” Nature 408(6811), 440–444 (2000).
[Crossref] [PubMed]

Pedder, J. E. A.

J. E. A. Pedder, A. S. Holmes, R. Allott, and K. Boehlen, “Pulsed laser ablation for volume micro-optical arrays on large area substrates,” Proc. SPIE 6462, 64620W (2007).
[Crossref]

Portalupi, S. L.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Priolo, F.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

L. Pavesi, L. Dal Negro, C. Mazzoleni, G. Franzò, and F. Priolo, “Optical gain in silicon nanocrystals,” Nature 408(6811), 440–444 (2000).
[Crossref] [PubMed]

Rakowski, M.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

Roelkens, G.

Ronneberg, E.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Salamo, G. J.

Scheerlinck, S.

J. Schrauwen, S. Scheerlinck, D. Van Thourhout, and R. Baets, “Polymer wedge for perfectly vertical light coupling to silicon,” Proc. SPIE 7218, 72180B (2009).
[Crossref]

Schrauwen, J.

J. Schrauwen, S. Scheerlinck, D. Van Thourhout, and R. Baets, “Polymer wedge for perfectly vertical light coupling to silicon,” Proc. SPIE 7218, 72180B (2009).
[Crossref]

Seeds, A.

Selvaraja, S.

Shakoor, A.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Smalbrugge, B.

Smit, M.

Song, J.

Tang, M.

Van Campenhout, J.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

Van Hoovels, N.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

Van Landschoot, L.

Van Steenberge, G.

K. S. Kaur, J. Missinne, and G. Van Steenberge, “Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer,” Appl. Phys. Lett. 104(6), 061102 (2014).
[Crossref]

Van Thourhout, D.

Verheyen, P.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

D. Vermeulen, S. Selvaraja, P. Verheyen, G. Lepage, W. Bogaerts, P. Absil, D. Van Thourhout, and G. Roelkens, “High-efficiency fiber-to-chip grating couplers realized using an advanced CMOS-compatible silicon-on-insulator platform,” Opt. Express 18(17), 18278–18283 (2010).
[Crossref] [PubMed]

Vermeulen, D.

Verstuyft, S.

Wang, Q. J.

Wang, Y.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Welna, K.

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Wolf, P.

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Wu, J.

Yao, J.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Yu, H.

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

Zheng, X.

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

Appl. Phys. Lett. (1)

K. S. Kaur, J. Missinne, and G. Van Steenberge, “Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer,” Appl. Phys. Lett. 104(6), 061102 (2014).
[Crossref]

IEEE J of Sel. Topics in Quant. Electron. (1)

M. Pantouvaki, H. Yu, M. Rakowski, P. Christie, P. Verheyen, G. Lepage, N. Van Hoovels, P. Absil, and J. Van Campenhout, “Comparison of silicon ring modulators with interdigitated and lateral PN junctions,” IEEE J of Sel. Topics in Quant. Electron. 19(2), 7900308–7900315 (2013).

IEEE J. Sel. Top. Quantum Electron. (1)

M. Müller, W. Hofmann, T. Grundl, M. Horn, P. Wolf, R. D. Nagel, E. Ronneberg, G. Bohm, D. Bimberg, and M. C. Amann, “1550-nm high-speed short-cavity VCSELs,” IEEE J. Sel. Top. Quantum Electron. 17(5), 1158–1166 (2011).
[Crossref]

Laser Photonics Rev. (1)

A. Shakoor, R. Lo Savio, P. Cardile, S. L. Portalupi, D. Gerace, K. Welna, S. Boninelli, G. Franzo’, F. Priolo, T. F. Krauss, M. Galli, and L. O’Faolain, “Room temperature all-silicon photonic crystal nanocavity light-emitting diode at sub-bandgap wavelengths,” Laser Photonics Rev. 7(1), 114–121 (2013).
[Crossref]

Nature (1)

L. Pavesi, L. Dal Negro, C. Mazzoleni, G. Franzò, and F. Priolo, “Optical gain in silicon nanocrystals,” Nature 408(6811), 440–444 (2000).
[Crossref] [PubMed]

Opt. Express (3)

Opt. Lett. (2)

Proc. SPIE (2)

J. E. A. Pedder, A. S. Holmes, R. Allott, and K. Boehlen, “Pulsed laser ablation for volume micro-optical arrays on large area substrates,” Proc. SPIE 6462, 64620W (2007).
[Crossref]

J. Schrauwen, S. Scheerlinck, D. Van Thourhout, and R. Baets, “Polymer wedge for perfectly vertical light coupling to silicon,” Proc. SPIE 7218, 72180B (2009).
[Crossref]

Other (3)

S. Selvaraja, P. De Heyn, G. Winroth, P. Ong, G. Lepage, C. Cailler, A. Rigny, K. Bourdelle, W. Bogaerts, D. Van Thourhout, J. Van Campenhout, and P. Absil, “Highly uniform and low-loss passive silicon photonics devices using a 300 mm CMOS platform,” in Optical Fiber Communication Conference, OSA Technical Digest online (Optical Society of America, 2014), pp. Th2A.33.

http://www.epixfab.eu

Y. Wang, S. Djordjecvic, J. Yao, J. Cunningham, X. Zheng, A. V. Krishnamoorthy, M. Muller, M. C. Amann, R. Bojko, N. A. F. Jaeger, and L. Chrostowski, “ Vertical-Cavity Surface-Emitting Laser Flip-Chip Bonding to Silicon Photonics Chip, ” in Proceedings of IEEE Optical Interconnects Conference (IEEE, 2015), pp. 122–123.
[Crossref]

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Figures (5)

Fig. 1
Fig. 1 Schematic for the process flow describing SU8 prism fabrication and VCSEL flip-chip integration on SOI GCs.
Fig. 2
Fig. 2 (top) Schematic of non-uniform laser ablation technique for SU8 prism fabrication on top of GCs, and (bottom) Variation of SU8 ablation depth (prism angle) w.r.t laser energy/writing speed as measured by a profilometer.
Fig. 3
Fig. 3 (a) Optical microscope image of the final VCSEL-to-SOI chip bonded assembly, with inset showing a 1 x 2 laser-diced VCSEL chip; (b) I-V characterization curves for the VCSEL prior and post bonding and (c) Optical spectrum of the bonded VCSEL measured through the output GC of the waveguide.
Fig. 4
Fig. 4 Comparison between the transmission curves recorded before and after SU8 prism fabrication on top of SOI GCs. The inset shows a plot, indicating the statistical distribution of the prisms’ performances at 1550 nm over 8 different samples.
Fig. 5
Fig. 5 Illustration of the experimental set-up used for performing NRZ transmission measurements on flip-chip bonded assemblies (top) and eye diagrams recorded for the bonded VCSELs at 10, 15 and 20 Gb/s (bottom).

Tables (1)

Tables Icon

Table 1 Optical loss values measured at different stages of the VCSEL-to-SOI integration process.

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