F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
J. Jin, “Dimensional metrology using the optical comb of a mode-locked laser,” Meas. Sci. Technol. 27(2), 1–17 (2016).
[Crossref]
J. Park, J. Jin, J.-A. Kim, and J. W. Kim, “Absolute distance measurement method without a non-measurable range and directional ambiguity based on the spectral-domain interferometer using the optical comb of the femtosecond pulse laser,” Appl. Phys. Lett. 109(24), 244103 (2016).
[Crossref]
H. Ahn, J. Park, J.-A. Kim, and J. Jin, “Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias,” J. Lightwave Technol. 34(23), 5462–5466 (2016).
[Crossref]
J. Park, J. Bae, J. Jin, J.-A. Kim, and J. W. Kim, “Vibration-insensitive measurements of the thickness profile of large glass panels,” Opt. Express 23(26), 32941–32949 (2015).
[Crossref]
[PubMed]
C. Moreno-Hernández, D. Monzón-Hernández, I. Hernández-Romano, and J. Villatoro, “Single tapered fiber tip for simultaneous measurements of thickness, refractive index and distance to a sample,” Opt. Express 23(17), 22141–22148 (2015).
[Crossref]
[PubMed]
J. Jin, S. Maeng, J. Park, J.-A. Kim, and J. W. Kim, “Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers,” Opt. Express 22(19), 23427–23432 (2014).
[Crossref]
[PubMed]
K. Zhang, L. Tao, W. Cheng, J. Liu, and Z. Chen, “Air etalon facilitated simultaneous measurement of group refractive index and thickness using spectral interferometry,” Appl. Opt. 53(31), 7483–7486 (2014).
[Crossref]
[PubMed]
H. Lee and K.-N. Joo, “Optical interferometric approach for measuring the geometrical dimension and refractive index profiles of a double-sided polished undoped Si wafer,” Meas. Sci. Technol. 25(7), 075202 (2014).
[Crossref]
S. C. Zilio, “Simultaneous thickness and group index measurement with a single arm low-coherence interferometer,” Opt. Express 22(22), 27392–27397 (2014).
[Crossref]
[PubMed]
J. Park, J. Jin, J. Wan Kim, and J.-A. Kim, “Measurement of thickness profile and refractive index variation of a silicon wafer using the optical comb of a femtosecond pulse laser,” Opt. Commun. 305(15), 170–174 (2013).
[Crossref]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and S. Lee, “Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process,” Opt. Express 20(5), 5011–5016 (2012).
[Crossref]
[PubMed]
S. Maeng, J. Park, B. O, and J. Jin, “Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser,” Opt. Express 20(11), 12184–12190 (2012).
[Crossref]
[PubMed]
P. Balling, P. Mašika, P. Křen, and M. Doležal, “Length and refractive index measurement by Fourier transform interferometry and frequency comb spectroscopy,” Meas. Sci. Technol. 23(9), 094001 (2012).
[Crossref]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and T. B. Eom, “Thickness and refractive index measurement of a silicon wafer based on an optical comb,” Opt. Express 18(17), 18339–18346 (2010).
[Crossref]
[PubMed]
W. A. Zortman, D. C. Trotter, and M. R. Watts, “Silicon photonics manufacturing,” Opt. Express 18(23), 23598–23607 (2010).
[Crossref]
[PubMed]
G. K. Celler and S. Cristoloveanu, “Frontiers of silicon-on-insulator,” J. Appl. Phys. 93(9), 4955–4978 (2003).
[Crossref]
M. Kimura, Y. Saito, H. Daio, and K. Yakushiji, “A new method for the precise measurement of wafer roll off of silicon polished wafer,” Jpn. J. Appl. Phys. 38(1), 38–39 (1999).
[Crossref]
P. Balling, P. Mašika, P. Křen, and M. Doležal, “Length and refractive index measurement by Fourier transform interferometry and frequency comb spectroscopy,” Meas. Sci. Technol. 23(9), 094001 (2012).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
G. K. Celler and S. Cristoloveanu, “Frontiers of silicon-on-insulator,” J. Appl. Phys. 93(9), 4955–4978 (2003).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
G. K. Celler and S. Cristoloveanu, “Frontiers of silicon-on-insulator,” J. Appl. Phys. 93(9), 4955–4978 (2003).
[Crossref]
M. Kimura, Y. Saito, H. Daio, and K. Yakushiji, “A new method for the precise measurement of wafer roll off of silicon polished wafer,” Jpn. J. Appl. Phys. 38(1), 38–39 (1999).
[Crossref]
P. Balling, P. Mašika, P. Křen, and M. Doležal, “Length and refractive index measurement by Fourier transform interferometry and frequency comb spectroscopy,” Meas. Sci. Technol. 23(9), 094001 (2012).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
J. Jin, “Dimensional metrology using the optical comb of a mode-locked laser,” Meas. Sci. Technol. 27(2), 1–17 (2016).
[Crossref]
J. Park, J. Jin, J.-A. Kim, and J. W. Kim, “Absolute distance measurement method without a non-measurable range and directional ambiguity based on the spectral-domain interferometer using the optical comb of the femtosecond pulse laser,” Appl. Phys. Lett. 109(24), 244103 (2016).
[Crossref]
H. Ahn, J. Park, J.-A. Kim, and J. Jin, “Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias,” J. Lightwave Technol. 34(23), 5462–5466 (2016).
[Crossref]
J. Park, J. Bae, J. Jin, J.-A. Kim, and J. W. Kim, “Vibration-insensitive measurements of the thickness profile of large glass panels,” Opt. Express 23(26), 32941–32949 (2015).
[Crossref]
[PubMed]
J. Jin, S. Maeng, J. Park, J.-A. Kim, and J. W. Kim, “Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers,” Opt. Express 22(19), 23427–23432 (2014).
[Crossref]
[PubMed]
J. Park, J. Jin, J. Wan Kim, and J.-A. Kim, “Measurement of thickness profile and refractive index variation of a silicon wafer using the optical comb of a femtosecond pulse laser,” Opt. Commun. 305(15), 170–174 (2013).
[Crossref]
S. Maeng, J. Park, B. O, and J. Jin, “Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser,” Opt. Express 20(11), 12184–12190 (2012).
[Crossref]
[PubMed]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and S. Lee, “Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process,” Opt. Express 20(5), 5011–5016 (2012).
[Crossref]
[PubMed]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and T. B. Eom, “Thickness and refractive index measurement of a silicon wafer based on an optical comb,” Opt. Express 18(17), 18339–18346 (2010).
[Crossref]
[PubMed]
H. Lee and K.-N. Joo, “Optical interferometric approach for measuring the geometrical dimension and refractive index profiles of a double-sided polished undoped Si wafer,” Meas. Sci. Technol. 25(7), 075202 (2014).
[Crossref]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and S. Lee, “Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process,” Opt. Express 20(5), 5011–5016 (2012).
[Crossref]
[PubMed]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and T. B. Eom, “Thickness and refractive index measurement of a silicon wafer based on an optical comb,” Opt. Express 18(17), 18339–18346 (2010).
[Crossref]
[PubMed]
J. Park, J. Jin, J.-A. Kim, and J. W. Kim, “Absolute distance measurement method without a non-measurable range and directional ambiguity based on the spectral-domain interferometer using the optical comb of the femtosecond pulse laser,” Appl. Phys. Lett. 109(24), 244103 (2016).
[Crossref]
J. Park, J. Bae, J. Jin, J.-A. Kim, and J. W. Kim, “Vibration-insensitive measurements of the thickness profile of large glass panels,” Opt. Express 23(26), 32941–32949 (2015).
[Crossref]
[PubMed]
J. Jin, S. Maeng, J. Park, J.-A. Kim, and J. W. Kim, “Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers,” Opt. Express 22(19), 23427–23432 (2014).
[Crossref]
[PubMed]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and S. Lee, “Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process,” Opt. Express 20(5), 5011–5016 (2012).
[Crossref]
[PubMed]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and T. B. Eom, “Thickness and refractive index measurement of a silicon wafer based on an optical comb,” Opt. Express 18(17), 18339–18346 (2010).
[Crossref]
[PubMed]
J. Park, J. Jin, J.-A. Kim, and J. W. Kim, “Absolute distance measurement method without a non-measurable range and directional ambiguity based on the spectral-domain interferometer using the optical comb of the femtosecond pulse laser,” Appl. Phys. Lett. 109(24), 244103 (2016).
[Crossref]
H. Ahn, J. Park, J.-A. Kim, and J. Jin, “Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias,” J. Lightwave Technol. 34(23), 5462–5466 (2016).
[Crossref]
J. Park, J. Bae, J. Jin, J.-A. Kim, and J. W. Kim, “Vibration-insensitive measurements of the thickness profile of large glass panels,” Opt. Express 23(26), 32941–32949 (2015).
[Crossref]
[PubMed]
J. Jin, S. Maeng, J. Park, J.-A. Kim, and J. W. Kim, “Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers,” Opt. Express 22(19), 23427–23432 (2014).
[Crossref]
[PubMed]
J. Park, J. Jin, J. Wan Kim, and J.-A. Kim, “Measurement of thickness profile and refractive index variation of a silicon wafer using the optical comb of a femtosecond pulse laser,” Opt. Commun. 305(15), 170–174 (2013).
[Crossref]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and S. Lee, “Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process,” Opt. Express 20(5), 5011–5016 (2012).
[Crossref]
[PubMed]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and T. B. Eom, “Thickness and refractive index measurement of a silicon wafer based on an optical comb,” Opt. Express 18(17), 18339–18346 (2010).
[Crossref]
[PubMed]
M. Kimura, Y. Saito, H. Daio, and K. Yakushiji, “A new method for the precise measurement of wafer roll off of silicon polished wafer,” Jpn. J. Appl. Phys. 38(1), 38–39 (1999).
[Crossref]
P. Balling, P. Mašika, P. Křen, and M. Doležal, “Length and refractive index measurement by Fourier transform interferometry and frequency comb spectroscopy,” Meas. Sci. Technol. 23(9), 094001 (2012).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
H. Lee and K.-N. Joo, “Optical interferometric approach for measuring the geometrical dimension and refractive index profiles of a double-sided polished undoped Si wafer,” Meas. Sci. Technol. 25(7), 075202 (2014).
[Crossref]
J. Jin, S. Maeng, J. Park, J.-A. Kim, and J. W. Kim, “Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers,” Opt. Express 22(19), 23427–23432 (2014).
[Crossref]
[PubMed]
S. Maeng, J. Park, B. O, and J. Jin, “Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser,” Opt. Express 20(11), 12184–12190 (2012).
[Crossref]
[PubMed]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
P. Balling, P. Mašika, P. Křen, and M. Doležal, “Length and refractive index measurement by Fourier transform interferometry and frequency comb spectroscopy,” Meas. Sci. Technol. 23(9), 094001 (2012).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
J. Park, J. Jin, J.-A. Kim, and J. W. Kim, “Absolute distance measurement method without a non-measurable range and directional ambiguity based on the spectral-domain interferometer using the optical comb of the femtosecond pulse laser,” Appl. Phys. Lett. 109(24), 244103 (2016).
[Crossref]
H. Ahn, J. Park, J.-A. Kim, and J. Jin, “Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias,” J. Lightwave Technol. 34(23), 5462–5466 (2016).
[Crossref]
J. Park, J. Bae, J. Jin, J.-A. Kim, and J. W. Kim, “Vibration-insensitive measurements of the thickness profile of large glass panels,” Opt. Express 23(26), 32941–32949 (2015).
[Crossref]
[PubMed]
J. Jin, S. Maeng, J. Park, J.-A. Kim, and J. W. Kim, “Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers,” Opt. Express 22(19), 23427–23432 (2014).
[Crossref]
[PubMed]
J. Park, J. Jin, J. Wan Kim, and J.-A. Kim, “Measurement of thickness profile and refractive index variation of a silicon wafer using the optical comb of a femtosecond pulse laser,” Opt. Commun. 305(15), 170–174 (2013).
[Crossref]
S. Maeng, J. Park, B. O, and J. Jin, “Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser,” Opt. Express 20(11), 12184–12190 (2012).
[Crossref]
[PubMed]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
M. Kimura, Y. Saito, H. Daio, and K. Yakushiji, “A new method for the precise measurement of wafer roll off of silicon polished wafer,” Jpn. J. Appl. Phys. 38(1), 38–39 (1999).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
J. Park, J. Jin, J. Wan Kim, and J.-A. Kim, “Measurement of thickness profile and refractive index variation of a silicon wafer using the optical comb of a femtosecond pulse laser,” Opt. Commun. 305(15), 170–174 (2013).
[Crossref]
M. Kimura, Y. Saito, H. Daio, and K. Yakushiji, “A new method for the precise measurement of wafer roll off of silicon polished wafer,” Jpn. J. Appl. Phys. 38(1), 38–39 (1999).
[Crossref]
J. Na, H. Y. Choi, E. S. Choi, C. Lee, and B. H. Lee, “Self-referenced spectral interferometry for simultaneous measurements of thickness and refractive index,” Appl. Opt. 48(13), 2461–2467 (2009).
[Crossref]
[PubMed]
K. Zhang, L. Tao, W. Cheng, J. Liu, and Z. Chen, “Air etalon facilitated simultaneous measurement of group refractive index and thickness using spectral interferometry,” Appl. Opt. 53(31), 7483–7486 (2014).
[Crossref]
[PubMed]
J. Park, J. Jin, J.-A. Kim, and J. W. Kim, “Absolute distance measurement method without a non-measurable range and directional ambiguity based on the spectral-domain interferometer using the optical comb of the femtosecond pulse laser,” Appl. Phys. Lett. 109(24), 244103 (2016).
[Crossref]
G. K. Celler and S. Cristoloveanu, “Frontiers of silicon-on-insulator,” J. Appl. Phys. 93(9), 4955–4978 (2003).
[Crossref]
F. Boeuf, S. Cremer, E. Temporiti, M. Fere, M. Shaw, C. Baudot, N. Vulliet, T. Pinguet, A. Mekis, G. Masini, H. Petiton, P. Le Maitre, M. Traldi, and L. Maggi, “Silicon photonics R&D and manufacturing on 300-mm wafer platform,” J. Lightwave Technol. 34(2), 286–295 (2016).
[Crossref]
H. Ahn, J. Park, J.-A. Kim, and J. Jin, “Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias,” J. Lightwave Technol. 34(23), 5462–5466 (2016).
[Crossref]
M. Kimura, Y. Saito, H. Daio, and K. Yakushiji, “A new method for the precise measurement of wafer roll off of silicon polished wafer,” Jpn. J. Appl. Phys. 38(1), 38–39 (1999).
[Crossref]
J. Jin, “Dimensional metrology using the optical comb of a mode-locked laser,” Meas. Sci. Technol. 27(2), 1–17 (2016).
[Crossref]
P. Balling, P. Mašika, P. Křen, and M. Doležal, “Length and refractive index measurement by Fourier transform interferometry and frequency comb spectroscopy,” Meas. Sci. Technol. 23(9), 094001 (2012).
[Crossref]
H. Lee and K.-N. Joo, “Optical interferometric approach for measuring the geometrical dimension and refractive index profiles of a double-sided polished undoped Si wafer,” Meas. Sci. Technol. 25(7), 075202 (2014).
[Crossref]
J. Park, J. Jin, J. Wan Kim, and J.-A. Kim, “Measurement of thickness profile and refractive index variation of a silicon wafer using the optical comb of a femtosecond pulse laser,” Opt. Commun. 305(15), 170–174 (2013).
[Crossref]
J. Jin, S. Maeng, J. Park, J.-A. Kim, and J. W. Kim, “Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers,” Opt. Express 22(19), 23427–23432 (2014).
[Crossref]
[PubMed]
J. Park, J. Bae, J. Jin, J.-A. Kim, and J. W. Kim, “Vibration-insensitive measurements of the thickness profile of large glass panels,” Opt. Express 23(26), 32941–32949 (2015).
[Crossref]
[PubMed]
W. A. Zortman, D. C. Trotter, and M. R. Watts, “Silicon photonics manufacturing,” Opt. Express 18(23), 23598–23607 (2010).
[Crossref]
[PubMed]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and T. B. Eom, “Thickness and refractive index measurement of a silicon wafer based on an optical comb,” Opt. Express 18(17), 18339–18346 (2010).
[Crossref]
[PubMed]
J. Jin, J. W. Kim, C.-S. Kang, J.-A. Kim, and S. Lee, “Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process,” Opt. Express 20(5), 5011–5016 (2012).
[Crossref]
[PubMed]
S. Maeng, J. Park, B. O, and J. Jin, “Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser,” Opt. Express 20(11), 12184–12190 (2012).
[Crossref]
[PubMed]
S. C. Zilio, “Simultaneous thickness and group index measurement with a single arm low-coherence interferometer,” Opt. Express 22(22), 27392–27397 (2014).
[Crossref]
[PubMed]
C. Moreno-Hernández, D. Monzón-Hernández, I. Hernández-Romano, and J. Villatoro, “Single tapered fiber tip for simultaneous measurements of thickness, refractive index and distance to a sample,” Opt. Express 23(17), 22141–22148 (2015).
[Crossref]
[PubMed]
BIPM, “Guide to the expression of uncertainty in measurement,” (JCGM 100:2008), http://www.bipm.org/en/publications/guides/gum.html .