S. Prayakarao, S. Robbins, N. Kinsey, A. Boltasseva, V. Shalaev, U. Wiesner, C. Bonner, R. Hussain, N. Noginova, and M. Noginov, “Gyroidal titanium nitride as nonmetallic metamaterial,” Opt. Mater. Express 5(6), 1316–1322 (2015).
[Crossref]
A. Anders, “A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS),” Surf. Coat. Tech. 257, 308–325 (2014).
[Crossref]
C.-L. Chang, S.-G. Shih, P.-H. Chen, W.-C. Chen, C.-T. Ho, and W.-Y. Wu, “Effect of duty cycles on the deposition and characteristics of high power impulse magnetron sputtering deposited TiN thin films,” Surf. Coat. Tech. 259, 232–237 (2014).
[Crossref]
K. A. Aissa, A. Achour, J. Camus, L. Le Brizoual, P.-Y. Jouan, and M.-A. Djouadi, “Comparison of the structural properties and residual stress of AlN films deposited by dc magnetron sputtering and high power impulse magnetron sputtering at different working pressures,” Thin Solid Films 550, 264–267 (2014).
[Crossref]
M. Aiempanakit, A. Aijaz, D. Lundin, U. Helmersson, and T. Kubart, “Understanding the discharge current behavior in reactive high power impulse magnetron sputtering of oxides,” J. Appl. Phys. 113(13), 133302 (2013).
[Crossref]
V. E. Babicheva, N. Kinsey, G. V. Naik, M. Ferrera, A. V. Lavrinenko, V. M. Shalaev, and A. Boltasseva, “Towards CMOS-compatible nanophotonics: Ultra-compact modulators using alternative plasmonic materials,” Opt. Express 21(22), 27326–27337 (2013).
[Crossref]
[PubMed]
H. T. Kim, J. Y. Park, and C. Park, “Effects of nitrogen flow rate on titanium nitride films deposition by DC facing target sputtering method,” Korean J. Chem. Eng. 29(5), 676–679 (2012).
[Crossref]
R. Bavadi and S. Valedbagi, “Physical properties of titanium nitride thin film prepared by DC magnetron sputtering,” Mater. Phys. Mech. 15, 167–172 (2012).
G. V. Naik, J. L. Schroeder, X. Ni, A. V. Kildishev, T. D. Sands, and A. Boltasseva, “Titanium nitride as a plasmonic material for visible and near-infrared wavelengths,” Opt. Mater. Express 2(4), 478–489 (2012).
[Crossref]
U. Guler, G. V. Naik, A. Boltasseva, V. M. Shalaev, and A. V. Kildishev, “Performance analysis of nitride alternative plasmonic materials for localized surface plasmon applications,” Appl. Phys. B 107(2), 285–291 (2012).
[Crossref]
J. B. Khurgin and A. Boltasseva, “Reflecting upon the losses in plasmonics and metamaterials,” MRS Bull. 37(08), 768–779 (2012).
[Crossref]
F. Magnus, A. S. Ingason, S. Olafsson, and J. T. Gudmundsson, “Nucleation and Resistivity of Ultrathin TiN Films Grown by High-Power Impulse Magnetron Sputtering,” IEEE Electron Device Lett. 33(7), 1045–1047 (2012).
[Crossref]
F. Magnus, A. S. Ingason, O. Sveinsson, S. Olafsson, and J. Gudmundsson, “Morphology of TiN thin films grown on SiO2 by reactive high power impulse magnetron sputtering,” Thin Solid Films 520(5), 1621–1624 (2011).
[Crossref]
A. Boltasseva and H. A. Atwater, “Materials science. Low-loss plasmonic metamaterials,” Science 331(6015), 290–291 (2011).
[Crossref]
[PubMed]
G. V. Naik, J. Kim, and A. Boltasseva, “Oxides and nitrides as alternative plasmonic materials in the optical range [Invited],” Opt. Mater. Express 1(6), 1090–1099 (2011).
[Crossref]
P. R. West, S. Ishii, G. V. Naik, N. K. Emani, V. M. Shalaev, and A. Boltasseva, “Searching for better plasmonic materials,” Laser Photonics Rev. 4(6), 795–808 (2010).
[Crossref]
K.-P. Chen, V. P. Drachev, J. D. Borneman, A. V. Kildishev, and V. M. Shalaev, “Drude relaxation rate in grained gold nanoantennas,” Nano Lett. 10(3), 916–922 (2010).
[Crossref]
[PubMed]
M. Lattemann, U. Helmersson, and J. Greene, “Fully dense, non-faceted 111-textured high power impulse magnetron sputtering TiN films grown in the absence of substrate heating and bias,” Thin Solid Films 518(21), 5978–5980 (2010).
[Crossref]
K. Sarakinos, J. Alami, and S. Konstantinidis, “High power pulsed magnetron sputtering: A review on scientific and engineering state of the art,” Surf. Coat. Tech. 204(11), 1661–1684 (2010).
[Crossref]
J. Lin, J. J. Moore, W. D. Sproul, B. Mishra, Z. Wu, and J. Wang, “The structure and properties of chromium nitride coatings deposited using dc, pulsed dc and modulated pulse power magnetron sputtering,” Surf. Coat. Tech. 204(14), 2230–2239 (2010).
[Crossref]
M. Samuelsson, D. Lundin, J. Jensen, M. A. Raadu, J. T. Gudmundsson, and U. Helmersson, “On the film density using high power impulse magnetron sputtering,” Surf. Coat. Tech. 205(2), 591–596 (2010).
[Crossref]
R. Machunze, A. Ehiasarian, F. Tichelaar, and G. Janssen, “Stress and texture in HIPIMS TiN thin films,” Thin Solid Films 518(5), 1561–1565 (2009).
[Crossref]
J.-H. Huang, F.-Y. Ouyang, and G.-P. Yu, “Effect of film thickness and Ti interlayer on the structure and properties of nanocrystalline TiN thin films on AISI D2 steel,” Surf. Coat. Tech. 201(16-17), 7043–7053 (2007).
[Crossref]
S. Konstantinidis, J. Dauchot, and M. Hecq, “Titanium oxide thin films deposited by high-power impulse magnetron sputtering,” Thin Solid Films 515(3), 1182–1186 (2006).
[Crossref]
M. Benegra, D. Lamas, M. F. De Rapp, N. Mingolo, A. Kunrath, and R. Souza, “Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering,” Thin Solid Films 494(1-2), 146–150 (2006).
[Crossref]
G. Janssen and J.-D. Kamminga, “Stress in hard metal films,” Appl. Phys. Lett. 85(15), 3086–3088 (2004).
[Crossref]
S. Logothetidis, E. Meletis, and G. Kourouklis, “New approach in the monitoring and characterization of titanium nitride thin films,” J. Mater. Res. 14(02), 436–441 (1999).
[Crossref]
J. H. Kang and K. J. Kim, “Structural, optical, and electronic properties of cubic TiNx compounds,” J. Appl. Phys. 86(1), 346–350 (1999).
[Crossref]
Y. Igasaki and H. Mitsuhashi, “The effects of substrate bias on the structural and electrical properties of TiN films prepared by reactive rf sputtering,” Thin Solid Films 70(1), 17–25 (1980).
[Crossref]
K. A. Aissa, A. Achour, J. Camus, L. Le Brizoual, P.-Y. Jouan, and M.-A. Djouadi, “Comparison of the structural properties and residual stress of AlN films deposited by dc magnetron sputtering and high power impulse magnetron sputtering at different working pressures,” Thin Solid Films 550, 264–267 (2014).
[Crossref]
M. Aiempanakit, A. Aijaz, D. Lundin, U. Helmersson, and T. Kubart, “Understanding the discharge current behavior in reactive high power impulse magnetron sputtering of oxides,” J. Appl. Phys. 113(13), 133302 (2013).
[Crossref]
M. Aiempanakit, A. Aijaz, D. Lundin, U. Helmersson, and T. Kubart, “Understanding the discharge current behavior in reactive high power impulse magnetron sputtering of oxides,” J. Appl. Phys. 113(13), 133302 (2013).
[Crossref]
K. A. Aissa, A. Achour, J. Camus, L. Le Brizoual, P.-Y. Jouan, and M.-A. Djouadi, “Comparison of the structural properties and residual stress of AlN films deposited by dc magnetron sputtering and high power impulse magnetron sputtering at different working pressures,” Thin Solid Films 550, 264–267 (2014).
[Crossref]
K. Sarakinos, J. Alami, and S. Konstantinidis, “High power pulsed magnetron sputtering: A review on scientific and engineering state of the art,” Surf. Coat. Tech. 204(11), 1661–1684 (2010).
[Crossref]
A. Anders, “A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS),” Surf. Coat. Tech. 257, 308–325 (2014).
[Crossref]
A. Boltasseva and H. A. Atwater, “Materials science. Low-loss plasmonic metamaterials,” Science 331(6015), 290–291 (2011).
[Crossref]
[PubMed]
R. Bavadi and S. Valedbagi, “Physical properties of titanium nitride thin film prepared by DC magnetron sputtering,” Mater. Phys. Mech. 15, 167–172 (2012).
M. Benegra, D. Lamas, M. F. De Rapp, N. Mingolo, A. Kunrath, and R. Souza, “Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering,” Thin Solid Films 494(1-2), 146–150 (2006).
[Crossref]
S. Prayakarao, S. Robbins, N. Kinsey, A. Boltasseva, V. Shalaev, U. Wiesner, C. Bonner, R. Hussain, N. Noginova, and M. Noginov, “Gyroidal titanium nitride as nonmetallic metamaterial,” Opt. Mater. Express 5(6), 1316–1322 (2015).
[Crossref]
V. E. Babicheva, N. Kinsey, G. V. Naik, M. Ferrera, A. V. Lavrinenko, V. M. Shalaev, and A. Boltasseva, “Towards CMOS-compatible nanophotonics: Ultra-compact modulators using alternative plasmonic materials,” Opt. Express 21(22), 27326–27337 (2013).
[Crossref]
[PubMed]
G. V. Naik, J. L. Schroeder, X. Ni, A. V. Kildishev, T. D. Sands, and A. Boltasseva, “Titanium nitride as a plasmonic material for visible and near-infrared wavelengths,” Opt. Mater. Express 2(4), 478–489 (2012).
[Crossref]
J. B. Khurgin and A. Boltasseva, “Reflecting upon the losses in plasmonics and metamaterials,” MRS Bull. 37(08), 768–779 (2012).
[Crossref]
U. Guler, G. V. Naik, A. Boltasseva, V. M. Shalaev, and A. V. Kildishev, “Performance analysis of nitride alternative plasmonic materials for localized surface plasmon applications,” Appl. Phys. B 107(2), 285–291 (2012).
[Crossref]
A. Boltasseva and H. A. Atwater, “Materials science. Low-loss plasmonic metamaterials,” Science 331(6015), 290–291 (2011).
[Crossref]
[PubMed]
G. V. Naik, J. Kim, and A. Boltasseva, “Oxides and nitrides as alternative plasmonic materials in the optical range [Invited],” Opt. Mater. Express 1(6), 1090–1099 (2011).
[Crossref]
P. R. West, S. Ishii, G. V. Naik, N. K. Emani, V. M. Shalaev, and A. Boltasseva, “Searching for better plasmonic materials,” Laser Photonics Rev. 4(6), 795–808 (2010).
[Crossref]
S. Prayakarao, S. Robbins, N. Kinsey, A. Boltasseva, V. Shalaev, U. Wiesner, C. Bonner, R. Hussain, N. Noginova, and M. Noginov, “Gyroidal titanium nitride as nonmetallic metamaterial,” Opt. Mater. Express 5(6), 1316–1322 (2015).
[Crossref]
K.-P. Chen, V. P. Drachev, J. D. Borneman, A. V. Kildishev, and V. M. Shalaev, “Drude relaxation rate in grained gold nanoantennas,” Nano Lett. 10(3), 916–922 (2010).
[Crossref]
[PubMed]
K. A. Aissa, A. Achour, J. Camus, L. Le Brizoual, P.-Y. Jouan, and M.-A. Djouadi, “Comparison of the structural properties and residual stress of AlN films deposited by dc magnetron sputtering and high power impulse magnetron sputtering at different working pressures,” Thin Solid Films 550, 264–267 (2014).
[Crossref]
C.-L. Chang, S.-G. Shih, P.-H. Chen, W.-C. Chen, C.-T. Ho, and W.-Y. Wu, “Effect of duty cycles on the deposition and characteristics of high power impulse magnetron sputtering deposited TiN thin films,” Surf. Coat. Tech. 259, 232–237 (2014).
[Crossref]
K.-P. Chen, V. P. Drachev, J. D. Borneman, A. V. Kildishev, and V. M. Shalaev, “Drude relaxation rate in grained gold nanoantennas,” Nano Lett. 10(3), 916–922 (2010).
[Crossref]
[PubMed]
C.-L. Chang, S.-G. Shih, P.-H. Chen, W.-C. Chen, C.-T. Ho, and W.-Y. Wu, “Effect of duty cycles on the deposition and characteristics of high power impulse magnetron sputtering deposited TiN thin films,” Surf. Coat. Tech. 259, 232–237 (2014).
[Crossref]
C.-L. Chang, S.-G. Shih, P.-H. Chen, W.-C. Chen, C.-T. Ho, and W.-Y. Wu, “Effect of duty cycles on the deposition and characteristics of high power impulse magnetron sputtering deposited TiN thin films,” Surf. Coat. Tech. 259, 232–237 (2014).
[Crossref]
S. Konstantinidis, J. Dauchot, and M. Hecq, “Titanium oxide thin films deposited by high-power impulse magnetron sputtering,” Thin Solid Films 515(3), 1182–1186 (2006).
[Crossref]
M. Benegra, D. Lamas, M. F. De Rapp, N. Mingolo, A. Kunrath, and R. Souza, “Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering,” Thin Solid Films 494(1-2), 146–150 (2006).
[Crossref]
K. A. Aissa, A. Achour, J. Camus, L. Le Brizoual, P.-Y. Jouan, and M.-A. Djouadi, “Comparison of the structural properties and residual stress of AlN films deposited by dc magnetron sputtering and high power impulse magnetron sputtering at different working pressures,” Thin Solid Films 550, 264–267 (2014).
[Crossref]
K.-P. Chen, V. P. Drachev, J. D. Borneman, A. V. Kildishev, and V. M. Shalaev, “Drude relaxation rate in grained gold nanoantennas,” Nano Lett. 10(3), 916–922 (2010).
[Crossref]
[PubMed]
R. Machunze, A. Ehiasarian, F. Tichelaar, and G. Janssen, “Stress and texture in HIPIMS TiN thin films,” Thin Solid Films 518(5), 1561–1565 (2009).
[Crossref]
P. R. West, S. Ishii, G. V. Naik, N. K. Emani, V. M. Shalaev, and A. Boltasseva, “Searching for better plasmonic materials,” Laser Photonics Rev. 4(6), 795–808 (2010).
[Crossref]
M. Lattemann, U. Helmersson, and J. Greene, “Fully dense, non-faceted 111-textured high power impulse magnetron sputtering TiN films grown in the absence of substrate heating and bias,” Thin Solid Films 518(21), 5978–5980 (2010).
[Crossref]
F. Magnus, A. S. Ingason, O. Sveinsson, S. Olafsson, and J. Gudmundsson, “Morphology of TiN thin films grown on SiO2 by reactive high power impulse magnetron sputtering,” Thin Solid Films 520(5), 1621–1624 (2011).
[Crossref]
F. Magnus, A. S. Ingason, S. Olafsson, and J. T. Gudmundsson, “Nucleation and Resistivity of Ultrathin TiN Films Grown by High-Power Impulse Magnetron Sputtering,” IEEE Electron Device Lett. 33(7), 1045–1047 (2012).
[Crossref]
M. Samuelsson, D. Lundin, J. Jensen, M. A. Raadu, J. T. Gudmundsson, and U. Helmersson, “On the film density using high power impulse magnetron sputtering,” Surf. Coat. Tech. 205(2), 591–596 (2010).
[Crossref]
U. Guler, G. V. Naik, A. Boltasseva, V. M. Shalaev, and A. V. Kildishev, “Performance analysis of nitride alternative plasmonic materials for localized surface plasmon applications,” Appl. Phys. B 107(2), 285–291 (2012).
[Crossref]
S. Konstantinidis, J. Dauchot, and M. Hecq, “Titanium oxide thin films deposited by high-power impulse magnetron sputtering,” Thin Solid Films 515(3), 1182–1186 (2006).
[Crossref]
M. Aiempanakit, A. Aijaz, D. Lundin, U. Helmersson, and T. Kubart, “Understanding the discharge current behavior in reactive high power impulse magnetron sputtering of oxides,” J. Appl. Phys. 113(13), 133302 (2013).
[Crossref]
M. Samuelsson, D. Lundin, J. Jensen, M. A. Raadu, J. T. Gudmundsson, and U. Helmersson, “On the film density using high power impulse magnetron sputtering,” Surf. Coat. Tech. 205(2), 591–596 (2010).
[Crossref]
M. Lattemann, U. Helmersson, and J. Greene, “Fully dense, non-faceted 111-textured high power impulse magnetron sputtering TiN films grown in the absence of substrate heating and bias,” Thin Solid Films 518(21), 5978–5980 (2010).
[Crossref]
C.-L. Chang, S.-G. Shih, P.-H. Chen, W.-C. Chen, C.-T. Ho, and W.-Y. Wu, “Effect of duty cycles on the deposition and characteristics of high power impulse magnetron sputtering deposited TiN thin films,” Surf. Coat. Tech. 259, 232–237 (2014).
[Crossref]
J.-H. Huang, F.-Y. Ouyang, and G.-P. Yu, “Effect of film thickness and Ti interlayer on the structure and properties of nanocrystalline TiN thin films on AISI D2 steel,” Surf. Coat. Tech. 201(16-17), 7043–7053 (2007).
[Crossref]
S. Prayakarao, S. Robbins, N. Kinsey, A. Boltasseva, V. Shalaev, U. Wiesner, C. Bonner, R. Hussain, N. Noginova, and M. Noginov, “Gyroidal titanium nitride as nonmetallic metamaterial,” Opt. Mater. Express 5(6), 1316–1322 (2015).
[Crossref]
Y. Igasaki and H. Mitsuhashi, “The effects of substrate bias on the structural and electrical properties of TiN films prepared by reactive rf sputtering,” Thin Solid Films 70(1), 17–25 (1980).
[Crossref]
F. Magnus, A. S. Ingason, S. Olafsson, and J. T. Gudmundsson, “Nucleation and Resistivity of Ultrathin TiN Films Grown by High-Power Impulse Magnetron Sputtering,” IEEE Electron Device Lett. 33(7), 1045–1047 (2012).
[Crossref]
F. Magnus, A. S. Ingason, O. Sveinsson, S. Olafsson, and J. Gudmundsson, “Morphology of TiN thin films grown on SiO2 by reactive high power impulse magnetron sputtering,” Thin Solid Films 520(5), 1621–1624 (2011).
[Crossref]
P. R. West, S. Ishii, G. V. Naik, N. K. Emani, V. M. Shalaev, and A. Boltasseva, “Searching for better plasmonic materials,” Laser Photonics Rev. 4(6), 795–808 (2010).
[Crossref]
R. Machunze, A. Ehiasarian, F. Tichelaar, and G. Janssen, “Stress and texture in HIPIMS TiN thin films,” Thin Solid Films 518(5), 1561–1565 (2009).
[Crossref]
G. Janssen and J.-D. Kamminga, “Stress in hard metal films,” Appl. Phys. Lett. 85(15), 3086–3088 (2004).
[Crossref]
M. Samuelsson, D. Lundin, J. Jensen, M. A. Raadu, J. T. Gudmundsson, and U. Helmersson, “On the film density using high power impulse magnetron sputtering,” Surf. Coat. Tech. 205(2), 591–596 (2010).
[Crossref]
K. A. Aissa, A. Achour, J. Camus, L. Le Brizoual, P.-Y. Jouan, and M.-A. Djouadi, “Comparison of the structural properties and residual stress of AlN films deposited by dc magnetron sputtering and high power impulse magnetron sputtering at different working pressures,” Thin Solid Films 550, 264–267 (2014).
[Crossref]
G. Janssen and J.-D. Kamminga, “Stress in hard metal films,” Appl. Phys. Lett. 85(15), 3086–3088 (2004).
[Crossref]
J. H. Kang and K. J. Kim, “Structural, optical, and electronic properties of cubic TiNx compounds,” J. Appl. Phys. 86(1), 346–350 (1999).
[Crossref]
J. B. Khurgin and A. Boltasseva, “Reflecting upon the losses in plasmonics and metamaterials,” MRS Bull. 37(08), 768–779 (2012).
[Crossref]
U. Guler, G. V. Naik, A. Boltasseva, V. M. Shalaev, and A. V. Kildishev, “Performance analysis of nitride alternative plasmonic materials for localized surface plasmon applications,” Appl. Phys. B 107(2), 285–291 (2012).
[Crossref]
G. V. Naik, J. L. Schroeder, X. Ni, A. V. Kildishev, T. D. Sands, and A. Boltasseva, “Titanium nitride as a plasmonic material for visible and near-infrared wavelengths,” Opt. Mater. Express 2(4), 478–489 (2012).
[Crossref]
K.-P. Chen, V. P. Drachev, J. D. Borneman, A. V. Kildishev, and V. M. Shalaev, “Drude relaxation rate in grained gold nanoantennas,” Nano Lett. 10(3), 916–922 (2010).
[Crossref]
[PubMed]
H. T. Kim, J. Y. Park, and C. Park, “Effects of nitrogen flow rate on titanium nitride films deposition by DC facing target sputtering method,” Korean J. Chem. Eng. 29(5), 676–679 (2012).
[Crossref]
J. H. Kang and K. J. Kim, “Structural, optical, and electronic properties of cubic TiNx compounds,” J. Appl. Phys. 86(1), 346–350 (1999).
[Crossref]
S. Prayakarao, S. Robbins, N. Kinsey, A. Boltasseva, V. Shalaev, U. Wiesner, C. Bonner, R. Hussain, N. Noginova, and M. Noginov, “Gyroidal titanium nitride as nonmetallic metamaterial,” Opt. Mater. Express 5(6), 1316–1322 (2015).
[Crossref]
V. E. Babicheva, N. Kinsey, G. V. Naik, M. Ferrera, A. V. Lavrinenko, V. M. Shalaev, and A. Boltasseva, “Towards CMOS-compatible nanophotonics: Ultra-compact modulators using alternative plasmonic materials,” Opt. Express 21(22), 27326–27337 (2013).
[Crossref]
[PubMed]
K. Sarakinos, J. Alami, and S. Konstantinidis, “High power pulsed magnetron sputtering: A review on scientific and engineering state of the art,” Surf. Coat. Tech. 204(11), 1661–1684 (2010).
[Crossref]
S. Konstantinidis, J. Dauchot, and M. Hecq, “Titanium oxide thin films deposited by high-power impulse magnetron sputtering,” Thin Solid Films 515(3), 1182–1186 (2006).
[Crossref]
S. Logothetidis, E. Meletis, and G. Kourouklis, “New approach in the monitoring and characterization of titanium nitride thin films,” J. Mater. Res. 14(02), 436–441 (1999).
[Crossref]
M. Aiempanakit, A. Aijaz, D. Lundin, U. Helmersson, and T. Kubart, “Understanding the discharge current behavior in reactive high power impulse magnetron sputtering of oxides,” J. Appl. Phys. 113(13), 133302 (2013).
[Crossref]
M. Benegra, D. Lamas, M. F. De Rapp, N. Mingolo, A. Kunrath, and R. Souza, “Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering,” Thin Solid Films 494(1-2), 146–150 (2006).
[Crossref]
M. Benegra, D. Lamas, M. F. De Rapp, N. Mingolo, A. Kunrath, and R. Souza, “Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering,” Thin Solid Films 494(1-2), 146–150 (2006).
[Crossref]
M. Lattemann, U. Helmersson, and J. Greene, “Fully dense, non-faceted 111-textured high power impulse magnetron sputtering TiN films grown in the absence of substrate heating and bias,” Thin Solid Films 518(21), 5978–5980 (2010).
[Crossref]
K. A. Aissa, A. Achour, J. Camus, L. Le Brizoual, P.-Y. Jouan, and M.-A. Djouadi, “Comparison of the structural properties and residual stress of AlN films deposited by dc magnetron sputtering and high power impulse magnetron sputtering at different working pressures,” Thin Solid Films 550, 264–267 (2014).
[Crossref]
J. Lin, J. J. Moore, W. D. Sproul, B. Mishra, Z. Wu, and J. Wang, “The structure and properties of chromium nitride coatings deposited using dc, pulsed dc and modulated pulse power magnetron sputtering,” Surf. Coat. Tech. 204(14), 2230–2239 (2010).
[Crossref]
S. Logothetidis, E. Meletis, and G. Kourouklis, “New approach in the monitoring and characterization of titanium nitride thin films,” J. Mater. Res. 14(02), 436–441 (1999).
[Crossref]
M. Aiempanakit, A. Aijaz, D. Lundin, U. Helmersson, and T. Kubart, “Understanding the discharge current behavior in reactive high power impulse magnetron sputtering of oxides,” J. Appl. Phys. 113(13), 133302 (2013).
[Crossref]
M. Samuelsson, D. Lundin, J. Jensen, M. A. Raadu, J. T. Gudmundsson, and U. Helmersson, “On the film density using high power impulse magnetron sputtering,” Surf. Coat. Tech. 205(2), 591–596 (2010).
[Crossref]
R. Machunze, A. Ehiasarian, F. Tichelaar, and G. Janssen, “Stress and texture in HIPIMS TiN thin films,” Thin Solid Films 518(5), 1561–1565 (2009).
[Crossref]
F. Magnus, A. S. Ingason, S. Olafsson, and J. T. Gudmundsson, “Nucleation and Resistivity of Ultrathin TiN Films Grown by High-Power Impulse Magnetron Sputtering,” IEEE Electron Device Lett. 33(7), 1045–1047 (2012).
[Crossref]
F. Magnus, A. S. Ingason, O. Sveinsson, S. Olafsson, and J. Gudmundsson, “Morphology of TiN thin films grown on SiO2 by reactive high power impulse magnetron sputtering,” Thin Solid Films 520(5), 1621–1624 (2011).
[Crossref]
S. Logothetidis, E. Meletis, and G. Kourouklis, “New approach in the monitoring and characterization of titanium nitride thin films,” J. Mater. Res. 14(02), 436–441 (1999).
[Crossref]
M. Benegra, D. Lamas, M. F. De Rapp, N. Mingolo, A. Kunrath, and R. Souza, “Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering,” Thin Solid Films 494(1-2), 146–150 (2006).
[Crossref]
J. Lin, J. J. Moore, W. D. Sproul, B. Mishra, Z. Wu, and J. Wang, “The structure and properties of chromium nitride coatings deposited using dc, pulsed dc and modulated pulse power magnetron sputtering,” Surf. Coat. Tech. 204(14), 2230–2239 (2010).
[Crossref]
Y. Igasaki and H. Mitsuhashi, “The effects of substrate bias on the structural and electrical properties of TiN films prepared by reactive rf sputtering,” Thin Solid Films 70(1), 17–25 (1980).
[Crossref]
J. Lin, J. J. Moore, W. D. Sproul, B. Mishra, Z. Wu, and J. Wang, “The structure and properties of chromium nitride coatings deposited using dc, pulsed dc and modulated pulse power magnetron sputtering,” Surf. Coat. Tech. 204(14), 2230–2239 (2010).
[Crossref]
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